The AMD Versal® Gen 2 Adaptive SoC represents a leap forward in heterogeneous computing. Built on a flexible and powerful architecture, it is designed to handle the most performance-critical, low-latency, and power-constrained AI applications across industries like finance, healthcare, automotive, and beyond. By combining AI acceleration engines, programmable FPGA fabric, and scalar processing cores into […]
Introduction Edge AI continues to transform how data is processed in real time, especially in autonomous, industrial, and defense systems where latency, size, and reliability are critical. AMD’s Versal® adaptive SoC family, introduced by Xilinx in 2019, brought a new class of heterogeneous computing by combining programmable logic, scalar processing, and the AI Engine […]
In a traditional edge AI system, the data journey is a fragmented one. Raw sensor data is processed by one chip (such as an FPGA), then a CPU performs some pre-processing, and finally, a GPU or dedicated accelerator handles the AI inference. This multi-chip architecture introduces latency, complexity, and unnecessary power consumption. The SE2000’s true […]
Rugged Edge AI for Aerospace, Automotive, and Beyond In embedded system design, few environments are as demanding as those found in aerospace, automotive, and military applications. Engineers working in these domains require platforms that are modular, compact, high-performance, and ruggedized. Enter the PCIe104 form factor, a long-standing standard for embedded systems in harsh environments, and […]
Introduction Modern medical imaging systems, ranging from MRI and CT scanners to PET and SPECT, demand exceptional reliability, precision, and uptime. These systems operate in environments where high-energy fields, radiation scatter, and electromagnetic interference are common. Such conditions increase the risk of Single Event Upsets (SEUs), bit-level errors caused by energetic particles interacting with semiconductor […]
Overview SundanceDSP specializes in the design and manufacturing of high-density electronic boards used in a wide range of mission-critical domains, including AI acceleration, industrial automation, medical imaging, defense systems, aerospace technologies, space applications, and real-time signal processing. The physical complexity and sensitivity of these boards require an advanced, systematic packaging approach that ensures electrostatic protection, […]
FPGA-Based Spur Suppression in the FMC-ADC500CD Introduction In high-speed digital signal acquisition systems, one of the most pressing challenges is increasing the sampling rate without compromising signal integrity. A widely used method to achieve this goal is ADC interleaving, which combines multiple ADC cores operating in parallel to emulate a higher effective sampling rate. However, […]
Reno, NV – [August 26, 2025]: SundanceDSP Inc., a pioneer in embedded computing systems, today announced the launch of the Solar Express 2000 (SE2000), a high-performance 3U OpenVPX board aligned with the SOSA™ Technical Standard. The SE2000 is designed around the groundbreaking AMD Versal™ AI Edge Series Gen 2 and Prime Series Gen 2 adaptive […]
Why Quality Standards Matter In the world of electronic manufacturing, quality isn’t just a preference; it’s a requirement. IPC, the Association Connecting Electronics Industries (originally known as the Institute for Printed Circuits), has developed a comprehensive suite of standards—such as IPC-A-610, IPC-J-STD-001, and IPC-A-600 that guide manufacturers in producing reliable, high-performance electronics. Among these are […]
Introduction In the rapidly evolving landscape of Edge AI, the demand for high-performance, low-power processing solutions is greater than ever. Applications in aerospace, medical, and industrial automation require a system that can handle diverse and complex data types, from radio frequency (RF) signals to high-resolution imagery, all in a compact and rugged form factor. This […]