This board serves as a precision‑engineered interposer and mechanical adapter between a VNX+ 19 mm, 400‑pin SBCIO PIM (Plug‑In Module) and a SOSA‑aligned OpenVPX Payload Slot conforming to profile MOD3‑PAY‑1F1F2U1TU1T1U1T‑16.2.15‑1.
Designed to simplify system integration, the adapter enables seamless insertion of a VNX+ module into a compatible VPX backplane slot without requiring any redesign of the host system. It preserves full signal mapping between the VNX+ PIM connector and the corresponding VPX interfaces defined by the SOSA Technical Standard.
This is a fully passive interposer, containing no active components, power regulation, or signal conditioning. Its purpose is purely mechanical and electrical adaptation, ensuring:
- Correct connector alignment and form‑factor translation
- Direct pass‑through of signals between VNX+ and VPX interfaces
- Mechanical stability for ruggedized or embedded deployments
- Compliance with SOSA and VNX+ mechanical envelope requirements
This adapter is ideal for developers and system integrators who need to evaluate, prototype, or deploy VNX+ processing modules within existing VPX‑based architectures, particularly in defense, aerospace, and high‑reliability embedded systems.
Features
- inerfaces VNX+ modulles to VPX
- VNX+ module will fit within VPX chassis envelope.
- SOSA compatible PIC connectors: MOD3-PAY-1F1F2U1TU1T1U1T-16.2.15-1 profile like.
- VNX+ 19 mm 400 pin SBCIO carrier connector to accept 19mm PIM.
- Most connections are 1 to 1.
- Control plane of OVPX CPtp connected to Ethernet port lanes of VNX+;
- S2 Overlay Mezz I/O pins of VNX+ will be routed to XMC – total 21 pairs;
- S2 Video plane will be routed to Video plane of Open VPX;
- USB 3.0 port and USB 2.0 port 2 will be routed;
- SATA port 1 will be routed;
- Power LEDs – for 12V, 5V, 3.3V power rails indications;
- Temperature range is 0°C to +70°C for extended temp and -40 to 85 for industrial grade.
Applications
- Rapid firmware/hardware development and testing
- High-performance data acquisition and signal processing
- Multi-chassis system integration
No BSP is available for this product.
VNXP-to-VPX






