Precision Packaging and Handling of High-Density Electronic Boards

Overview

SundanceDSP specializes in the design and manufacturing of high-density electronic boards used in a wide range of mission-critical domains, including AI acceleration, industrial automation, medical imaging, defense systems, aerospace technologies, space applications, and real-time signal processing. The physical complexity and sensitivity of these boards require an advanced, systematic packaging approach that ensures electrostatic protection, traceability, mechanical integrity, and safe delivery to end users.

This article outlines SundanceDSP’s end-to-end handling and packaging procedure, designed to preserve board quality from post-manufacture imaging through testing, inventory control, and final dispatch.

Step 1: High-Resolution Imaging After Manufacturing

Immediately following manufacturing, each board is visually inspected and photographed using a high-resolution imaging setup. This image:

  • Captures the board’s as-manufactured condition
  • Records component population, serial label placement, and solder joint quality
  • Serves as a reference point for future quality assurance and support

The image is archived and linked to the board’s serial number within SundanceDSP’s internal stock management platform.

Step 2: Board-Specific Functional Testing

Each board undergoes a customized test procedure defined during its design phase. These tests verify that every functional block, interface, and electrical pathway performs according to design specifications.

The primary goals of this phase are to:

  • Confirm board-level compliance with its documented requirements
  • Validate operational readiness of interfaces and subsystems
  • Ensure the board meets performance criteria across expected use cases

All results, pass/fail status, and detailed diagnostics are systematically recorded in the stock management system under the board’s serial identifier, enabling complete traceability and post-delivery confidence.

ESD Protocol During Testing

To protect against electrostatic discharge:

  • Technicians wear grounded anti-static gloves and wrist straps
  • Boards are placed on anti-static trays throughout the testing process
  • Workstations and floors are covered with grounded ESD mats
  • All tools and contact surfaces are ESD-safe

These controls ensure zero exposure to static electricity at every point of contact.

Step 3: Anti-Static Sleeving and Inventory Registration

After successful testing, each board is gently placed into a dimension-matched anti-static sleeve. Sleeves are selected based on board dimensions and connector placement to avoid stress on any soldered components or exposed interface areas.

Sleeve specifications include:

  • MIL-PRF-81705 Type III compliance for electrostatic protection
  • Sizing to prevent movement while ensuring safe insertion/removal
  • Use of ESD-safe gloves and handling tools during packaging

Once sleeved, the board is officially entered into inventory. The system record includes:

  • Serial number and board revision
  • Date of testing
  • Full test results and pre-test image documentation

This data structure forms the backbone of SundanceDSP’s logistics, audit, and customer service workflows.

Stockroom ESD Safety

SundanceDSP’s stockroom is designed for long-term board protection:

  • Boards are stored in specialized anti-static boxes
  • Floors are layered with ESD-safe mats to dissipate static while walking or handling inventory
  • All shelving and containers follow ESD-safe standards

This ensures boards remain protected even during extended inventory storage or retrieval.

Step 4: Retrieval and Shipping Assignment

When a customer order is processed, designated boards are retrieved from inventory using their serial numbers and batch metadata. The following details are logged:

  • Serial number of each board selected
  • Associated customer or project identifier
  • Retrieval date and shipment status

This process guarantees visibility and traceability at every stage of fulfillment.

Step 5: Static-Safe Packaging for Shipment

Boards in their anti-static sleeves are then placed into purpose-selected static-protective foam shippers. Packaging choices depend on the number and size of boards being shipped.

Standard shipping boxes feature:

Element Specification
Foam Inserts Convoluted anti-static polyurethane, sized per board geometry
Corrugated Box Strength Double-walled, 200 lb. test rating for crush resistance
Assembly Format Glued foam lid and removable base for secure containment
Optional Wrap Anti-static bubble wrap added if boards need extra isolation

Boards are precisely positioned within foam cavities to minimize vibration and avoid component collision. If required, additional anti-static cushioning and tape are applied to ensure zero movement during transit.

Step 6: Final Dispatch Using Agreed Logistics Method

Sealed boxes are labeled and handed off for shipment using the method specified by the customer, whether via courier, freight service, or direct integration into customer-managed logistics.

Final records include:

  • Shipment tracking number and delivery method
  • Serial numbers of all enclosed boards
  • Linkage to original stock entry for verification and post-delivery support

This seamless connection between inventory, quality assurance, and outbound logistics ensures every board shipped by SundanceDSP is accounted for, protected, and backed by full documentation.

Conclusion

SundanceDSP’s packaging workflow is designed to support precision, safety, and transparency across all industries served—from laboratory environments to space-grade applications. By embedding documentation, imaging, testing, and ESD-safe packaging into its operational procedures, SundanceDSP delivers fully verified, production-ready electronic boards with the care and reliability demanded by today’s high-performance markets.