SE50-3G/SDI

Mini PCIe IO and processing module based on Microsemi PolarFire MPF300T-1FCVG484 FPGA

The SE50-3G-SDI is a small footprint mini-PCIe board with support for 3G/SDI videos. It uses PolarFire MPF300T-1FCVG484E FPGA for processing and to interface to the host. A TI LMH0397 chip is used for 3G/SDI functionality. It has 2 U.FL connectors which can be used as 2 Outputs or as one Input and one Output.

There is a complete  BSP for supporting RedHat 7.9 or Ubuntu 20.04 for the host operating system. For detailed information, please contact the Sundance support team. Below is a short list of features and functions available as part of BSP:

  1. Support for 3G and SDI, RAW and Formatted modes
  2. Support for two modes of operation:
    1. Idle/Capture.
    2. Playback
  3. Ability to read from the host and send to output
  4. Ability to capture and write to the host and save to file
  5. Capture and send to output
  6. Supports Y C′bC′r 4:2:2  formats:
    1. 10bit: 1080p30, 720p60, 1080p60, 1080p25, 720p50, 1080p50;
    2. 12bit: 1080p30, 1080p25;
    3. Support of 30/1.001 & 60/1.001 variants;
  7. RGB 4:4:4 format: 10bit: 1080p24;

Features

  • MPF300T-1FCVG484E PolarFire FPGA from Microchip
  • LMH0397 3G-SDI 75-Ω bidirectional I/O with integrated re-clocker
  • One 1024×16 DDR4 chip for RAM (2GB of DDR4) in 16-bit data-bus
  •  PCIe x1 Gen2 as EP
  • 128Mbyte SPI chip for ROM
  • A programmable clock generator based on SI5338A can generate any frequency
  • Reference generator 27MHz±25ppm;
  • One U.FL connector is used as a video input/output, second U.FL connector is used as a video output, or loopback output
  • USB-JTAG/UART connector on the front panel
  • Two user LEDs, Green and Red
  • Temperature range, -40°C to +85°C;
  • The maximum power consumption of the board is 10W 
 

Applications

  • Industrial Automation
  • Control
  • Defense
  • imaging
Component side Solder Side Module with U.FL cable

 

 

Block Diagram

Placement Diagram

 

SE50-3G/SDI   includes the hardware, 2 cables, and the BSP firmware in binary form

SE50-3G/SDI-source    includes the hardware, 2 cables, and the BSP  with the firmware in source form

SE50-MPF100-1-E    Mini-PCIe module with -1 speed grade MPF100T-1FCVG484E, JTAG interface, 4 GB of DDR4, and SPI FLASH.

SE50-MPF200-1-E    Mini-PCIe module with -1 speed grade MPF200T-1FCVG484E, JTAG interface, 4 GB of DDR4, and SPI FLASH.

SE50-MPF300-1-E    Mini-PCIe module with -1 speed grade MPF300T-1FCVG484E, JTAG interface, 4 GB of DDR4, and SPI FLASH.

 

The products listed above are chips with an extended temperature range; for the Industrial temperature range please order:

SE50-MPF100-1-I

SE50-MPF200-1-I

SE50-MPF300-1-I