Blogs

SundanceDSP is proud to announce that we have completed our first CMMC Level 2 Self-Assessment in accordance with DoD CMMC 2.0 requirements, meeting all applicable Level 2 assessment objectives, with senior official affirmation submitted in SPRS. A major milestone...

Edge AI Implementation: Bringing Intelligence to Hardware Introduction to Part 2 In Part 1 of this tutorial, we established the fundamental concepts of artificial intelligence, machine learning, and neural networks from the perspective of FPGA and embedded systems...

Reno, Nevada — [1/27/2026] — Sundance, a leading provider of modular, FPGA‑based embedded computing solutions, today announced that its VNX+ to 3U VPX Adapter has completed manufacturing and is now ready for immediate shipment to customers worldwide. This marks the...

At the intersection of space exploration and electronic manufacturing lies a critical challenge: ensuring hardware reliability in the harshest environment known to humanity. This success story highlights how our engineering team’s expertise and flexible...

Architectural Differences and Their Impact on VPX Systems Introduction AMD’s Versal™ Adaptive SoC architecture combines scalar processors, programmable logic, and AI Engines into a unified heterogeneous compute platform. Versal Gen 1 established this architecture and...

A Foundation for FPGA and Embedded Systems Engineers Introduction As FPGA and embedded systems engineers, you’ve spent years mastering the intricacies of hardware design, timing constraints, resource optimization, and real-time processing. You understand the...

2025 wasn’t just a successful year for Sundance DSP; it was a breakout period where we redefined what high-performance embedded computing can achieve. Through relentless innovation and deep customer collaboration, our team delivered technologies that set new...

We are thrilled to announce that Sundance DSP has officially begun development on our latest high-speed imaging solution: the FMC-CLV. This new FMC (FPGA Mezzanine Card) is set to revolutionize how you interface Camera Link cameras with the latest high-performance...

The SE300 Multi-FPGA SoC platform from SundanceDSP is now fully manufactured, with its Board Support Package (BSP) ready. Companies interested in accelerating their innovation can order samples today and begin development immediately. Built on the PolarFire SoC...