The AMD Versal® Gen 2 Adaptive SoC represents a leap forward in heterogeneous computing. Built on a flexible and powerful architecture, it is designed to handle the most performance-critical, low-latency, and power-constrained AI applications across industries like...
- Camera Link vs. Camera Link HS: Interfaces, Connectors, and Development Platforms
- SundanceDSP Completes CMMC Level 2 Self-Assessment: Strengthening Trust, Security, and Mission-Critical Innovation
- Understanding Artificial Intelligence Part 2
- SundanceDSP Announces VNX+ to 3U VPX Adapter Is Now Fully Manufactured and Ready for Shipment
- Enabling Space Missions Through Advanced Manufacturing Solutions
- Versal™ Gen 1 vs. Versal™ Gen 2
- Understanding Artificial Intelligence Part 1
- A Triumphant Year: Sundance DSP Redefines Embedded Computing in 2025
- Announcing the Next Generation: Development Starts on the Sundance FMC-CLV for Camera Link Integration!
- SE300 Multi-FPGA SoC Platform: Advanced Development Board Now Available
AMD Versal Gen 2: Low-Latency, Power-Efficient AI for the Real World
Powering Edge AI: Inside AMD’s Versal Gen 2 AI Engine
Introduction Edge AI continues to transform how data is processed in real time, especially in autonomous, industrial, and defense systems where latency, size, and reliability are critical. AMD’s Versal® adaptive SoC family, introduced by Xilinx in 2019, brought...
SE2000: A Single Chip for the Entire AI Pipeline
In a traditional edge AI system, the data journey is a fragmented one. Raw sensor data is processed by one chip (such as an FPGA), then a CPU performs some pre-processing, and finally, a GPU or dedicated accelerator handles the AI inference. This multi-chip...
PCIe104 Form Factor and PCIe104-JET
Rugged Edge AI for Aerospace, Automotive, and Beyond In embedded system design, few environments are as demanding as those found in aerospace, automotive, and military applications. Engineers working in these domains require platforms that are modular, compact,...
Mitigating SEUs in Medical Imaging Systems: A Hardware Perspective with PolarFire SoC
Introduction Modern medical imaging systems, ranging from MRI and CT scanners to PET and SPECT, demand exceptional reliability, precision, and uptime. These systems operate in environments where high-energy fields, radiation scatter, and electromagnetic interference...
Precision Packaging and Handling of High-Density Electronic Boards
Overview SundanceDSP specializes in the design and manufacturing of high-density electronic boards used in a wide range of mission-critical domains, including AI acceleration, industrial automation, medical imaging, defense systems, aerospace technologies, space...
Increasing Sampling Rate Using ADC Interleaving Challenges
FPGA-Based Spur Suppression in the FMC-ADC500CD Introduction In high-speed digital signal acquisition systems, one of the most pressing challenges is increasing the sampling rate without compromising signal integrity. A widely used method to achieve this goal is ADC...
SundanceDSP Unveils SE2000: A Cutting-Edge SOSA-Aligned OpenVPX AI Acceleration Card Powered by AMD Versal™ AI Edge Series Gen 2 and Prime Series Gen 2 Adaptive SoCs
Reno, NV – [August 26, 2025]: SundanceDSP Inc., a pioneer in embedded computing systems, today announced the launch of the Solar Express 2000 (SE2000), a high-performance 3U OpenVPX board aligned with the SOSA™ Technical Standard. The SE2000 is designed around the...
Understanding IPC Classes in Electronic Board Manufacturing
Why Quality Standards Matter In the world of electronic manufacturing, quality isn’t just a preference; it’s a requirement. IPC, the Association Connecting Electronics Industries (originally known as the Institute for Printed Circuits), has developed a...
Unified Edge AI Processing System with PCIe104Jet and PCIe104-RFSOC
Introduction In the rapidly evolving landscape of Edge AI, the demand for high-performance, low-power processing solutions is greater than ever. Applications in aerospace, medical, and industrial automation require a system that can handle diverse and complex data...
FMC-GPIO68SE: A Versatile FPGA Mezzanine Card for Developers
Introduction In the dynamic world of FPGA development, the need for flexible and reliable input/output (I/O) interfaces is critical for building robust systems. Among the various FMC IO modules available, the FMC-GPIO68SE from Sundance DSP stands out for its...
FG650: Four-Channel Camera Link Frame Grabber on FPGA
The FG650 pairs the FMC-CL mezzanine module with the SE120 carrier board to form a complete, FPGA-based solution for capturing and processing four Camera Link streams in real time. The FMC-CL handles the physical I/O for up to four connectors, while the SE120 hosts...










